Texas Instruments - 2


(SOIC) DB, DL - Shrink Small-Outline Package

(SSOP) DBB.DGV-Thin Very Small-Outline Package

(TVSOP) DBC) - Quarter-Size Outline Package

(QSOP) DBV - Small-Outline Transistor Package

(SOT) DCK - Small-Outline Package (SOP)

DGG, PW - Thin Shrink Small-Outline Package

(TSSOP) FK - Leadless Ceramic Chip Carrier (LCCC)

FN - Plastic Leaded Chip Carrier (PLCC)

GB - Ceramic Pin Grid Array (CPGA)

HFP, HS, HT, HV - Ceramic Quad Flat Package (CQFP)

J, JT-Ceramic Dual-In-Line Package (CDIP)

N, NP, NT- Plastic Dual-In-Line Package (PDIP)

PAG, PAH, PCA, PCB, PM, PN, PZ-Plastic Thin Quad Flat Package (TQFP)

PH, PQ, RC - Plastic Quad Flat Package (QFP)

W, WA, WD - Ceramic Flat Package (CFP)

  • :

  • LE - ( DB PW )

    R - ( DGG, DBB, DGV, DBV; D, DL, and DW packages)